Power chips are linked to outside circuits with packaging, and their performance relies on the support of the product packaging. In high-power situations, power chips are usually packaged as power components. Chip affiliation refers to the electric connection on the top surface area of the chip, which is normally aluminum bonding cable in conventional modules. ^
Standard power component bundle cross-section
Today, business silicon carbide power modules still mostly use the product packaging modern technology of this wire-bonded traditional silicon IGBT component. They face problems such as big high-frequency parasitic parameters, not enough warm dissipation capability, low-temperature resistance, and inadequate insulation strength, which restrict making use of silicon carbide semiconductors. The display of outstanding performance. In order to solve these problems and fully exploit the substantial prospective benefits of silicon carbide chips, several brand-new product packaging innovations and options for silicon carbide power modules have arised in recent times.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have actually established from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually established from gold wires to copper cords, and the driving force is cost decrease; high-power tools have created from light weight aluminum cables (strips) to Cu Clips, and the driving pressure is to enhance product performance. The better the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared with typical bonding product packaging techniques, Cu Clip innovation has the following benefits:
1. The connection between the chip and the pins is made of copper sheets, which, to a specific degree, replaces the common cable bonding technique between the chip and the pins. For that reason, an one-of-a-kind bundle resistance worth, higher current circulation, and much better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can fully conserve the price of silver plating and poor silver plating.
3. The item appearance is entirely constant with typical products and is mostly made use of in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding approach
Both eviction pad and the Resource pad are clip-based. This bonding technique is a lot more costly and intricate, yet it can accomplish far better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The source pad makes use of a Clip technique, and eviction utilizes a Wire technique. This bonding approach is a little less costly than the all-copper bonding technique, conserving wafer location (appropriate to extremely tiny gateway locations). The process is simpler than the all-copper bonding technique and can obtain much better Rdson and far better thermal effect.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding alloy of copper and zinc, please feel free to contact us and send an inquiry.
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